CHIPF2010 was strongly supported by many international packaging associations, such as WPO, APF and PPMA. The exhibition covers an area of 60,000 sqm and attracted about 500 enterprises plus tens of thousands of visitors. About 1,000 leaders from competitive packaging corporations attended the exhibition. It can be said that CHIPF2010 had a great impact upon world packaging industry. CHIPF will choose Better Packaging, More Success as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging safety. In the meanwhile, CHIPF will continue to broaden internationa
Profiles for exhibit includes Packaging material and products: Paper packaging material and products, plastic packaging material and products, metal packaging material and products, composite packaging material and products, auxiliary packaging material, glass packaging products, wooden material packaging and products. Packaging machinery and equipment: Packaging machinery, packaging printing machinery, packaging material and products production line and packaging test equipment. Packaging technology and others: Resources recycling technology and products, packaging high-tech and products, RFID products, packaging printing technology and design, packaging presentation of education and scientific research projects, typical client presentation of packaging products and packaging service products.