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    Beijing International Packaging Fair

    China New International Exhibition..     |    Beijing, China    |    30 Jun-02 Jul 2014    Remind Me

    Attend

    CHIPF2010 was strongly supported by many international packaging associations, such as WPO, APF and PPMA. The exhibition covers an area of 60,000 sqm and attracted about 500 enterprises plus tens of thousands of visitors. About 1,000 leaders from competitive packaging corporations attended the exhibition. It can be said that CHIPF2010 had a great impact upon world packaging industry. CHIPF will choose Better Packaging, More Success as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging safety. In the meanwhile, CHIPF will continue to broaden internationa

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    Visitors Attending

    Mariam Kamara

    Ceo at God First Trading Enterprises

    Banjul, The Gambia

    Mariam Kamara

    Mian Ahmed Akbar

    Director at Pioneer Feeds Pvt Ltd.

    Karachi, Pakistan

    Mian Ahmed Akbar

    Mickey Pirada

    Www.baanbunchupan.com at 40000

    Khon Kaen, Thailand

    Mickey Pirada

    Daniel Koechlin

    Food at Rosetea Sac

    Lima, Peru

    Daniel Koechlin

    Ahmed Wattar

    Ceo at Dar Elsalam

    Baghdad, Iraq

    Ahmed Wattar

    Enayat

    Chairman at Oraman

    Tehran, Iran

    Enayat

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    Exhibitor Profile

    Profiles for exhibit includes Packaging material and products: Paper packaging material and products, plastic packaging material and products, metal packaging material and products, composite packaging material and products, auxiliary packaging material, glass packaging products, wooden material packaging and products. Packaging machinery and equipment: Packaging machinery, packaging printing machinery, packaging material and products production line and packaging test equipment. Packaging technology and others: Resources recycling technology and products, packaging high-tech and products, RFID products, packaging printing technology and design, packaging presentation of education and scientific research projects, typical client presentation of packaging products and packaging service products.

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