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Advanced Packaging Forum Heterogeneous Integration


Advanced Packaging Forum - Heterogeneous Integration aims to achieve higher performance, smaller size, higher reliability and lower power consumption for electronic chips and products are driving the advanced packaging forward in these days. AI, Autonomous Car, 5G, IoT and other new applications are enabling a new vision era of advanced packaging technologies-Heterogeneous Integration. In this forum, experts from leading Heterogeneous Packaging and Testing, Equipment and Materials supplier are invited to share their treasure experiences on the future technology development roadmap, challenges and packaging solution.


Timings

09:00 AM-06:00 PM (expected)
Not Verified

Entry Fees

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Participants

100 - 500
Delegates

10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Packing & Packaging
IT & Technology

Editions

18 - 20 Mar 2020 Interested
21 Mar 2019


Frequency Annual

Official Links

Website Contacts


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Event Happening Alongside
SEMICON China 18 - 20 Mar 2020
Fpd China 18 - 20 Mar 2020
2 more event

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SEMI China China

Renowned 19 events listed
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User Community [ Users who have shown interest for this Event ]

Sandeep Kumar

Sandeep Kumar

CMD at Somaxe Packaging Industry

New Delhi, India
wang yonggang

wang yonggang

Professor/Teacher at Civil Aviation University ofChina

Tianjin, China

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