Advanced Packaging Forum Heterogeneous Integration

Advanced Packaging Forum - Heterogeneous Integration aims to achieve higher performance, smaller size, higher reliability and lower power consumption for electronic chips and products are driving the advanced packaging forward in these days. AI, Autonomous Car, 5G, IoT and other new applications are enabling a new vision era of advanced packaging technologies-Heterogeneous Integration. In this forum, experts from leading Heterogeneous Packaging and Testing, Equipment and Materials supplier are invited to share their treasure experiences on the future technology development roadmap, challenges and packaging solution.


09:00 AM-06:00 PM (expected)
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Entry Fees

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100 - 500

10 - 50 Exhibitors Estimated Count

Category & Type

Packing & Packaging
IT & Technology


18 - 20 Mar 2020 Interested
21 Mar 2019

Frequency Annual

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Sandeep Kumar

Sandeep Kumar

CMD at Somaxe Packaging Industry

New Delhi, India
wang yonggang

wang yonggang

Professor/Teacher at Civil Aviation University ofChina

Tianjin, China

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