9th Edition Conference

Annual Dieline Conference

04 - 07 May 2020 Postponed  New Date Reminder
McCormick Place, Chicago, USA

About Followers 7 Reviews Exhibitors Photos Speakers Travel Deals

Annual Dieline Conference remains the most influential and comprehensive package design & branding conference around, serving as a focal point for designers who work on consumer brands. This year's conference will explore how the most creative brands in the world can push us forward while creating sustainable, innovative, and proprietary consumer experiences. With a heavy focus on sustainability, we'll discuss the evolution and future of consumer brands and product packaging. Featuring a lineup of some of the world’s leading brands, agencies, designers, and sustainability experts, you will learn how to maximize the power of smart package design and branding for today's consumer.


09:00 AM-06:00 PM (expected)
Not Verified

Entry Fees

Check Official Website


100 - 500
Estimated Count

Category & Type

Packing & Packaging


04 - 07 May 2020 9th Edition

Frequency Newly Listed

Official Links


Report Error
Claim this event


Logo Follow Company

Dieline Media, LLC USA

Newly listed 1 Upcoming Events

User Community [ Users who have shown interest for this Event ]

GoingFathia mohamed SALIH

Fathia mohamed SALIH

Teacher at Saudia Arabia

Khartoum, Sudan
GoingRachel Bowling

Rachel Bowling

VP of Operations at Commercial Packaging

Bloomington, United States
Donna Greene

Donna Greene

Teaching at SUNY Oswego

Oswego, United States
Art Department

Art Department

Graphic Designer at Plews & Edelmann

Dixon, United States


Package Design at Kynd Packaging

Scottsdale, United States
William DeLoi

William DeLoi

Package Designer at Mars, Inc.

Hackettstown, United States
Kristin Knudson

Kristin Knudson

Designer at Redphone Inc.

Calgary, Canada
41.851229 -87.617034

Venue Map & Directions

map of McCormick Place

McCormick Place

2301 S King Dr Chicago IL 60616

Get Directions

Featured Hotels in Chicago

More Hotels