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Conference

Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS


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Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. It will cover areas like design, modeling, testing, micro-machining, integration, and packaging of structures, devices and systems, and much more.

Timings

09:00 AM-06:00 PM (expected)
* not verified

Entry Fees

Not available*
* Check Official Website

Participants

upto 100 DelegatesEstimated Count

Category & Type

Conference
Packing & Packaging
Industrial Engineering

Editions

12-15 May 2019

Frequency Not Available

Official Links

Website Contacts


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Universite Montpellier 1 France

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GOKULA KRISHNAN RAVI

GOKULA KRISHNAN RAVI

Deputy Manager at DCPL SOFTWARE PVT LTD Chennai, India

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FIAP Jean Monnet

30 Rue Cabanis, 75014 Paris
France

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