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Conference

Electronics Design for Manufacturability DfM: Avoiding Failure After Reflow

18 Jun 2020

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Join us for this free webinar, in which we’ll review several considerations for electronics DfM. A variety of examples will be presented including general guidelines, physical examples, as well as simulation. Leveraging simulation can help predict and avoid loads that cause printed circuit board assembly (PCBA) issues such as component cracking, pad cratering, or solder fracture. An Ansys Sherlock workflow will be presented to highlight how simulation can be used to evaluate post-soldering manufacturing and assembly processes.


Timings

Starts at 11:00 AM GMT-4:00

Entry Fees

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Participants

upto 100
Delegates
Based on previous editions

Category & Type

Conference
Industrial Engineering

Editions

18 Jun 2020


Frequency Not Available

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Ansys

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