InterPACK is an international conference and exhibition focused on packaging and integration of electronic and photonic microsystems. It is the premier forum for exchanging state-of-the-art knowledge in research, development, manufacturing and applications of electronics packaging and heterogeneous integration.
Timings09:00 AM-06:00 PM (expected)
Entry FeesCheck Official Website
Estimated Turnout1000 - 5000
100 - 500 Exhibitors Based on previous editions
Event TypeTrade Show
Frequency Not Available
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