13 - 14 Oct 2020Ended

International Water Level Packaging Conference


Estimated Turnout

upto 100
Based on previous editions


13 - 14 Oct 2020


Not Available
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Participate in this virtual event to gain a deeper understanding of the manufacturing technology enabling 5G communications, AI, IoT, automotive and .. Read more more. IWLPC  is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond  reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

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