10times
26 - 28 Oct 2021 • 

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

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Estimated Turnout

upto 100
Delegates
Based on previous editions

Editions

Oct 2021
+1 more edition

Frequency

Annual
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Join us at InterPACK, a systems-focused international technical conference & exhibition on packaging & integration of electronic & photonic microsystems, held virtually.

2   Different Located Editions
Anaheim, USA27 - 29 Oct 2020
4 Followers
San Francisco, USA27 - 30 Aug 2018
33 Followers
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American Society of Mechanical Engineers

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