Boston Chapter Webinar: Controlling Oxidation & Intermetallics in Moisture-sensitive Devices

To avoid the damage of microcracks and delamination during the processing of electronic components, appropriate environmental storage is essential. .. Read more The introduction of lead-free soldering and the associated higher processing temperatures involved makes moisture management even more important. Lead-free reflow increases the consequent saturated vapor pressure within components considerably (up to 30 bars).