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14 Dec 2020Ended

Boston Chapter Webinar: Controlling Oxidation & Intermetallics in Moisture-sensitive Devices

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Estimated Turnout

upto 100
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Based on previous editions

Editions

14 Dec 2020

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Not Available
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To avoid the damage of microcracks and delamination during the processing of electronic components, appropriate environmental storage is essential. .. Read more The introduction of lead-free soldering and the associated higher processing temperatures involved makes moisture management even more important. Lead-free reflow increases the consequent saturated vapor pressure within components considerably (up to 30 bars).

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