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13 - 14 Oct 2020Ended

International Wafer Level Packaging Conference

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Timings

09:00 AM - 06:00 PM
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Estimated Turnout

100 - 500
Delegates
Based on previous editions

Editions

13 - 14 Oct 2020

Frequency

Not Available
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IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The .. Read more technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

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SAMEER PATIL

SAMEER PATIL

Regional Sales Manager at INDOFIL INDUSTRIES LIMITED

Mumbai, India
Bhisaji L Ghadigaonkar

Bhisaji L Ghadigaonkar

Plant Co-Ordinator at Ritewater Solutions India Pvt Ltd

Thane, India
Jane Hyun Jung Lee

Jane Hyun Jung Lee

Technical Director at nepes US

Aliso Viejo, United States
Rajan Mishra

Rajan Mishra

Cipetian at Central institute of plastics engineering and Technology Lucknow

Lucknow, India
Efrain peniche lope

Efrain peniche lope

Owner at La carpeta talleres gráficos

Merida, Mexico
M R N HARSHA TEJA

M R N HARSHA TEJA

Partner at SRI VAIBHAVA DURGA PLASTICS

Narasaraopet, India
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