20 May 2021Ended

Puget Sound Webinar: Developing a Process for No-Clean & Cleanable Flux Systems to IPC J-STD-001H


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upto 100
Based on previous editions


May 2021


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The assembly process must be controlled and handled in such a way as not to leave active process residues that can cause reliability issues. Today’.. Read more s soldering fluxes are composed of organic acids designed to be decomposed by the molten solder temperatures during the soldering process. Low profile and bottom terminated components can prevent outgassing by underfilling the component with flux residue and thereby shielding the flux ingredients from reaching the deactivation temperature. Active flux residues can lead to electro-chemical migration due to leaving an acid that can be mobilized into moisture. This acidic electrolyte will mobilize metal ions that can result in leakage currents.

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