| About | Followers 5 | Exhibitors | Speakers | Reviews | Deals |
This exhibition specializes in packaging technology such as manufacturing and assembly equipment for semiconductors and sensors, packaging materials, and plating technology. Semiconductor/sensor, electronics, automobile/electrical component manufacturers are welcome to visit us to discuss design issues and productivity improvement issues.
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Timings09:00 AM-06:00 PM (expected)Not Verified | Entry FeesCheck Official Website |
Estimated Turnout1000 - 5000Visitors 100 - 500 Exhibitors Based on previous editions | Event TypeTrade Show |
EditionsJan 2024, Koto InterestedJan 2022, Online +1 more edition Frequency Annual | Official LinksWebsiteContactsReport Error Claim this event |
| Event Happening Alongside INTERNEPCON JAPAN 24 - 26 Jan 2024 86 Followers Electronic Component... 24 - 26 Jan 2024 303 Followers IC & Sensor Packagin... 24 - 26 Jan 2024 54 Followers PRINTED WIRING BOARD... 24 - 26 Jan 2024 23 Followers ELECTROTEST JAPAN 24 - 26 Jan 2024 42 Followers EV JAPAN - EV / HV /... 24 - 26 Jan 2024 56 Followers Nepcon Japan 24 - 26 Jan 2024 83 Followers International Car El... 24 - 26 Jan 2024 140 Followers | |
Organizer | |
Why to Attend?
Popular among visitors for
Top 100 in Packing & Packaging in Japan
EditionJan 2024
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Venue Map & Directions
3 Chome-3-11-1 Ariake KOtO-ku TOkyO-to 135-0063 Japan
Koto,
Japan
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