IEEE Electrical Design of Advanced Packaging and Systems

IEEE Electrical Design of Advanced Packaging and Systems, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.


09:00 AM-06:00 PM (expected)
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upto 100
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Packing & Packaging


16 - 18 Dec 2019 Interested

Frequency Newly Listed

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National Sun Yat-sen University Taiwan

9 events listed
22.619482 120.296618

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Grand Hi Lai Hotel

No. 266, Chenggong 1st Road, Qianjin District, Kaohsiung City 801
Xinxing District, Taiwan

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