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Conference

IEEE Electrical Design of Advanced Packaging and Systems


IEEE Electrical Design of Advanced Packaging and Systems, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.


Timings

09:00 AM-06:00 PM (expected)
Not Verified

Entry Fees

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Participants

upto 100
Delegates
Estimated Count

Category & Type

Conference
Packing & Packaging

Editions

16 - 18 Dec 2019 Interested


Frequency Newly Listed

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National Sun Yat-sen University Taiwan

9 events listed
22.619482 120.296618

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Grand Hi Lai Hotel

No. 266, Chenggong 1st Road, Qianjin District, Kaohsiung City 801
Xinxing District, Taiwan

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