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"Conference focus on 3D technology and R&D processes in Europe"
The European 3D TSV Summit, organized by the SEMI Europe will take place from 22nd January to the 24th January 2018 at the MINATEC Campus in Grenoble, France. The conference will cover areas like development and growth of our industries and manufacturing regions by organizing regional trade events (expositions), trade missions, and conferences; by engaging local and national governments and policy makers; through fostering collaboration; by conducting industry research and reporting market data; and by supporting other initiatives that encourage investment, trade, and technology innovation.
Timings09:00 AM-06:00 PM (expected)
Entry FeesCheck Official Website
Estimated Turnout100 - 500
DelegatesBased on previous editions
Category & TypeConference
Electric & Electronics
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