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21st Edition Trade Show

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

05 - 08 Jul 2020 Add To Calendar
Vienna House Andel’s Lodz, Łódź, Poland

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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems an exhibition of suppliers of experimental characterization equipment, and simulation and optimization software, demonstrating their latest features. Results of some EU funded projects will be exposed in a dedicated session. The conference provides the opportunity to single domain simulation, multi-physics simulation, material characterization, and validation, emerging modeling methods and tools and etc.


Timings

09:00 AM-06:00 PM (expected)
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Entry Fees

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Participants

1000 - 5000
Visitors

100 - 500 Exhibitors Estimated Count

Category & Type

Trade Show
Industrial Engineering
IT & Technology

Editions

05 - 08 Jul 2020 Interested


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Cracow University of Technology Poland

13 Total Events / 3 Upcoming Events
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Azhar Ali Zafar

Azhar Ali Zafar

Post Doctoral Fellow at Lodz University of Technology

Aleksandrow Lodzki, Poland
51.778433 19.448564

Venue Map & Directions

map of Vienna House Andel’s Lodz

Vienna House Andel’s Lodz

Ogrodowa 17, 91-065 Łódź, Poland
Poland

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