|About||Followers 1||Exhibitors||Speakers||Reviews||Travel Deals|
Seminar on Heat Dissipation Concepts For Power Electronics focuses on the conception of electronic cooling for power modules. This event will focus is on thermal interface materials between components or assemblies as heat sources and heat sinks. The differences between the various thermally conductive systems are explained in detail, from the classic thermal compound to modern phase change materials and the thinnest, filled films. Lectures on heatsinks, heatpipes and fans complement the hardware technologies.
Timings09:00 AM-06:00 PM (expected)
Entry FeesCheck Official Website
Estimated Turnout100 - 500
DelegatesBased on previous editions
Category & TypeConference
Power & Energy
Frequency Not Available
Claim this event
Queries about the event? Ask Organizer
122 Total Events
Why to Attend?
Followers [ Users who have shown interest for this Event ] Join Community Invite