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21 - 23 Jan 2026

IC & Sensor Packaging Technology EXPO

Trade Show
Tokyo Big Sight, Koto, JapanGet Directions
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About 128 ExhibitorsSpeakersReviewsDeals

Highlights

  • Popular among visitors for

Timings

10:00 AM - 06:00 PM (General)
10:00 AM - 05:00 PM (General)

Entry Fees

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Estimated Turnout

20.0k
Visitors

100 - 500 Exhibitors Based on previous editions

Event Type

Trade Show

Editions

Jan 2026 Interested
+18 more editions

Frequency Annual

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Rxglobal Top Rated38 Total Events • 1105 Followers

35.629820139.794242

Venue Map & Directions

3 Chome-3-11-1 Ariake KOtO-ku TOkyO-to 135-0063 Japan
Koto, Japan

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Frequently Asked Questions Contact Organizer


Can I get a list of exhibitors participating in the event?
There are approx exhibitors participating in this event. To get the list of exhibitors, please visit our website or to get the list on mail, register at the link .
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EditionJan 2026

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Exhibitors Profile

Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.

Exhibitors List

9 Exhibitors of Current Edition

NEPCON JAPAN TOP

Website

ELECTRONIC COMPONENTS & MATERIALS EXPO

ELECTROTEST JAPAN

FINE PROCESS TECHNOLOGY EXPO

35.629820139.794242

Venue Map & Directions

map of Tokyo Big Sight

3 Chome-3-11-1 Ariake KOtO-ku TOkyO-to 135-0063 Japan
Koto, Japan

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