International Conference on Electronics Packaging

22 - 25 Apr 2020 Add To Calendar
Miraikan Museum of Emerging Science and Innovation Tokyo, Koto, Japan

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The International Conference on Electronics Packaging is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions and it provides a strong platform to demonstrate your technologies and products as well as expand your customer network. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.


09:00 AM-06:00 PM (expected)
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Entry Fees

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100 - 500

10 - 50 Exhibitors Estimated Count

Category & Type

Packing & Packaging
IT & Technology


22 - 25 Apr 2020 Interested

Frequency Newly Listed

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Japan Institute of Electronics Packaging (JIEP) Japan

4 Total Events / 1 Upcoming Event
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User Community [ Users who have shown interest for this Event ]

GoingAzhar Hossain

Azhar Hossain

Dhaka, Bangladesh at M/s Nasim Electric

Dhaka, Bangladesh
Moein Tamizi

Moein Tamizi

Ph.D candidate at Sharif University of Technology

Shahriar, Iran
joseph Betsalel

joseph Betsalel

CEO at O.B.D

Tel Aviv-Yafo, Israel
35.619225 139.776762

Venue Map & Directions

map of Miraikan Museum of Emerging Science and Innovation Tokyo

Miraikan Museum of Emerging Science and Innovation Tokyo

2 Chome-3-6 Aomi Jiangdong District KOtO-ku TOkyO-to 135-0064 Japan
Koto, Japan

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