International Conference on Electronics Packaging

The International Conference on Electronics Packaging, organized by the IEEE CPMT Society will take place from 20th April to the 22nd April 2016 at the Sapporo Education and Culture Hall in Sapporo, Japan. The conference will cover areas like Advanced Packaging, Substrate and Interposers, Interconnection, 3DIC Packaging, Design, Modeling, and Reliability, Thermal Management, Materials and Process, Printed Electronics, N-MEMS, Optoelectronics, Self-Organization/Self-Assembly, Medical Devices, Power Electronics Integration and other co-related issues.