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The International Conference on Electronics Packaging, organized by the IEEE CPMT Society will take place from 20th April to the 22nd April 2016 at the Sapporo Education and Culture Hall in Sapporo, Japan. The conference will cover areas like Advanced Packaging, Substrate and Interposers, Interconnection, 3DIC Packaging, Design, Modeling, and Reliability, Thermal Management, Materials and Process, Printed Electronics, N-MEMS, Optoelectronics, Self-Organization/Self-Assembly, Medical Devices, Power Electronics Integration and other co-related issues.
Timings09:00 AM-06:00 PM (expected)Not Verified | Entry FeesCheck Official Website |
Participants100 - 500 Delegates Based on previous editions | Category & TypeConferenceElectric & Electronics |
EditionsApr 2016Frequency Not Available | Official LinksWebsiteContactsReport Error Claim this event |
Online Editions International Conference on Electronics Packaging 12 - 14 May 2021 | |
Different Located Editions Koto, Japan12 - 15 May 2021 6 Followers Niigata, Japan17 - 20 Apr 2019 4 Followers Kuwana, Japan17 - 21 Apr 2018 2 Followers Kyoto, Japan14 - 17 Apr 2015 1 Followers Toyama, Japan23 - 25 Apr 2014 | |
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User Community [ Users who have shown interest for this Event ]

Chiranjibi Gautam
Managing Director at Sky Link Export And Import Pvt.ltd
New Delhi, India
Francis Twum Boateng
Electrician at Ferrowsti Enterprise
Accra, Ghana
Mohamed Jabir
President at Sha Enterprises
Kandy, Sri LankaWrite a Review
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Sapporo Education and Culture Hall
13 Chome-1 Kita 1 JÅnishi, ChÅ«Å-ku, Sapporo-shi, HokkaidÅ 060-0001
Japan
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