International Conference on Electronics Packaging

The International Conference on Electronics Packaging, organized by the IEEE Advancing Technology For Humanity will take place from 23rd April to the 25th April 2014 at the Toyama International Conference Center in Toyama, Japan. The conference will cover areas like Advanced Packaging, Substrate and Interposers, Interconnection, 3DIC Packaging, Design, Modeling, and Reliability, Thermal Management, Materials and Process, Printed Electronics, N MEMS, Optoelectronics, Self Organization or Self Assembly, Medical Devices, Power Devices, RF and many other topics.