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Conference

International Conference on Electronic Packaging Technology


International Conference on Electronic Packaging Technology aims to cover the latest development of packaging and manufacturing technologies for ICs, optoelectronics, passives, and MEMS.

Timings

09:00 AM-06:00 PM (expected)
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Entry Fees

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Participants

100 - 500 Delegates
10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Electric & Electronics
Packing & Packaging

Editions

11-15 Aug 2019


Frequency Not Available

Official Links

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Hong Kong University of Science and Technology Hong Kong

23 events listed

User Community [Users who have shown interest for this Event]

foelanwang

foelanwang

fund at supersearch capital ltd Bago, Myanmar
Dave Davidson

Dave Davidson

CEO at Davida Roofing Company Limited Tema, Ghana
Ido Sapir

Ido Sapir

IT at sapir IT solutions Haifa, Israel
John Greaves

John Greaves

Patent Attorney at Schwegman Lundberg & Woessner PA Salt Lake, United States
Leung

Leung

pa at Ijen Hong Kong
Wong Kc

Wong Kc

Asst D at Chivas Corporation Ltd Hong Kong
LAM

LAM

COO at Tradeport Hong Kong

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