ISTA Forum

16 - 19 Mar 2020  New Date Reminder
Disneys Yacht Club Resort, Orlando, USA

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ISTA Forum brings together the packaging community through two co-located events, TransPack and TempPack. TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport. TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack event creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.


09:00 AM-06:00 PM (expected)
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100 - 500
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Category & Type

Packing & Packaging


16 - 19 Mar 2020

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Logo Follow Company

Newcom Business Media Inc. Canada

Renowned 7 Total Events / 3 Upcoming Events

User Community [ Users who have shown interest for this Event ]

Susan Ruane

Susan Ruane

Professor at Michigan State University

Farmington Hills, United States
Santosh pathak

Santosh pathak

Proprietor at Mazak mould and tool

New Delhi, India
Michael S Dellinger

Michael S Dellinger

Marketing Manager at Closure Systems International

Indianapolis, United States

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