10times
Conference

International Symposium on Microelectronics and Packaging and International Conference on Electronic Materials and Packaging


International Symposium on Microelectronics and Packaging and International Conference on Electronic Materials and Packaging will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new technology directions. We cordially invite you to submit abstracts for the conference and look forward to seeing you in Korea.


Timings

09:00 AM-06:00 PM (expected)
Not Verified

Entry Fees

Check Official Website

Participants

100 - 500
Delegates

10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Electric & Electronics
Packing & Packaging

Editions

13-15 Nov 2019 Interested


Frequency Newly Listed

Official Links

Website Contacts


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The Korean Microelectronics and Packaging Society South Korea

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User Community [ Users who have shown interest for this Event ]

GoingDONATUS OZOEMENA EZEJI

DONATUS OZOEMENA EZEJI

Director General at DTEX INTERNATIONALLTD

Lagos, Nigeria
ANSELM UGWUJA

ANSELM UGWUJA

Automobile Engineering at Seojeong University

Seoul, South Korea
Chung-seock Kang

Chung-seock Kang

Vice President at Kolon Industries Inc.

Seoul, South Korea
Nnaji Jeffeverest Onyekachi

Nnaji Jeffeverest Onyekachi

Sales Manager at CLASS A COMPUTERS

Monrovia, Liberia
Sulaimon Abiodun

Sulaimon Abiodun

Doctor at Helga Nigeria Limited

Apata Ibadan, Nigeria
35.154074 129.118838

Venue Map & Directions

map of Hotel Aqua Palace

Hotel Aqua Palace

225 Gwanganhaebyeon-ro, Gwangan 2(i)-dong, Suyeong-gu, Busan, South Korea
South Korea

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