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Conference

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems


The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The conference will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

Timings

09:00 AM-06:00 PM (expected)
* not verified

Entry Fees

Not available*
* Check Official Website

Participants

upto 100 DelegatesEstimated Count

Category & Type

Conference
Electric & Electronics
Industrial Engineering

Editions

28-31 May 2019 Interested

Frequency Newly Listed

Official Links

Website Contacts


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Different Located Editions
San Diego, USA 29 May-01 Jun 2018
5 Followers
Orlando, USA 30 May-02 Jun 2017

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Organizer

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Anveshak TEchnology and Knowledge Solutions USA

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User Community

Dubi Gal

Dubi Gal

CEO at Gal Tech San Diego, United States
Harpreet singh

Harpreet singh

Lab Technician at sant longowal institute of engineering and technology Sangrur, India

Speakers

Speaker
Gaurang Choksi

Gaurang Choksi

Vice-President at Intel Corp Chandler, United States
Speaker
Andrew Alleyne

Andrew Alleyne

Director at NSF Engineering Research Center for Power Optimization Illinois, United States
Speaker
Cullen Bash

Cullen Bash

VP of R&D at Hewlett Packard Enterprise San Francisco, United States
36.109755 -115.173877

Venue Map & Directions

map of The Cosmopolitan of Las Vegas

The Cosmopolitan of Las Vegas

3708 S Las Vegas Blvd Las Vegas NV 89109
USA

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