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Conference

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems


The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The conference will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.


Timings

09:00 AM-06:00 PM (expected)
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Entry Fees

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Participants

100 - 500
Delegates

10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Electric & Electronics
Industrial Engineering

Editions

28-31 May 2019


Frequency Not Available

Official Links

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Organizer

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Anveshak TEchnology and Knowledge Solutions USA

4 events listed

User Community [ Users who have shown interest for this Event ]

Budianto

Budianto

Managing Director at PT. AVIOPRO INOVASI TERDEPAN

Medan, Indonesia
Dubi Gal

Dubi Gal

CEO at Gal Tech

San Diego, United States
Harpreet singh

Harpreet singh

Lab Technician at sant longowal institute of engineering and technology

Sangrur, India

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Speakers

Speaker
Gaurang Choksi

Gaurang Choksi

Vice-President at Intel Corp Chandler, United States
Speaker
Cullen Bash

Cullen Bash

VP of R&D at Hewlett Packard Enterprise San Francisco, United States
Speaker
Andrew Alleyne

Andrew Alleyne

Director at NSF Engineering Research Center for Power Optimization Illinois, United States
36.109755 -115.173877

Venue Map & Directions

map of The Cosmopolitan of Las Vegas

The Cosmopolitan of Las Vegas

3708 S Las Vegas Blvd Las Vegas NV 89109
USA

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