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11th Edition  Conference

MEPTEC Symposium on Integrated MEMS Technology


For inanimate objects, microelectromechanical systems sensing is sufficiently accurate. Measuring and providing meaningful information about people, however, is significantly more complex. This challenge may be why some technologists differentiate types of sensors based on their location off-body, on-body wearable, and in-body implantable or digestible, as their packaging and functionality significantly vary. As more applications move to on-body, and in-body sensors emerge, sensor sophistication and packaging technologies need to significantly improve. Self-administered medical diagnostics are envisioned using one’s smartphone as the computing and communication engine.


Timings

09:00 AM-06:00 PM (expected)
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Entry Fees

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Participants

100 - 500
Delegates

10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Industrial Engineering
IT & Technology

Editions

19 - 21 Nov 2019 Interested


Frequency Newly Listed

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Microelectronics Packaging and Test Engineering Council USA

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lamberth Diotegiri

lamberth Diotegiri

plant design and construction at Diolansyn eng.co.ltd

Inzai, Japan
Scott Barrie

Scott Barrie

Sales Engineer at Hamamatsu Photonics

Welwyn Garden, United Kingdom
34.705056 137.735694

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ACT CITY HAMAMATSU

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Japan

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