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25th Edition  Conference

International Symposium for Design and Technology in Electronic Packaging


International Symposium for Design and Technology in Electronic Packaging focuses on Emerging Topics in Advanced Packaging, New Components and Manufacturing Technologies, Printed Electronics, Smart Textiles and Healthcare, Sensors, Actuators and Microsystems, Nanomaterials, Nanoelectronics and Nanotechnology, Embedded Systems, Robotics and Artificial Intelligence, Power Electronics and Thermal Management and etc.


Timings

09:00 AM-06:00 PM (expected)
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Entry Fees

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Participants

100 - 500
Delegates

10 - 50 Exhibitors Estimated Count

Category & Type

Conference
Electric & Electronics
Packing & Packaging

Editions

23 - 26 Oct 2019 25th Edition


Frequency Not Available

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Organizer

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Center for Technological Electronics and Interconnection Techniques Romania

3 events listed

User Community [ Users who have shown interest for this Event ]

Rıdvan Vatansever

Rıdvan Vatansever

Marketing Director at Minorca Business Development Center

Bursa, Turkey
Elochukwu Jude Chukwunonso

Elochukwu Jude Chukwunonso

Importer/Contractor at Judoscarnet International Nigeria Limited

Lagos, Nigeria

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