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Conference

Webinar: Solderability Benchmarking, Failures & Production Testing Methods

06 Jul 2020

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The webinar provides an introduction and a better understanding of the soldering process and the effect of poor solderability on modern manufacture. Surface mount components can be a problem area, as are some of the surface finishes used on printed circuit boards. The online session aims to provide a basic understanding of solderability failure including ageing, test methods, both theoretical and practical, for circuit boards and components. It also shows how to test BGAs, LGA, CSP, PoP and flip chip packages on the shop floor in 10min. The webinar gives practical hands-on experience of solderability testing of different solder finishes and assessment of results. Using the instructor’s unique video material many process faults will be demonstrated. In process testing non laboratory testing is illustrated as well as the correlation with real process conditions.


Timings

Starts at 09:30 AM GMT-4:00

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upto 100
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Category & Type

Conference
Industrial Engineering

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06 Jul 2020 Interested


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