TransPack Forum

The TransPack Forum, organized by the ISTA will take place from 18th April to 21st April 2017 at the Disneys Yacht Club Resort in Orlando, United States Of America. The conference will cover areas like Rapidly Changing Consumer Habits and Impact of Digital Technology on Consumer Packaged Goods Industry, Application of a Triboelectric Energy Harvester in Transport Packaging, Using Six Degree of Freedom (6DOF) Sensors to Measure and Model Vehicle and Package Motion.

Visitors Attending

Olvie Trisna Sudjiman

Olvie Trisna Sudjiman

Passenger Ground Handling at QatarDubai, United Arab Emirates
Amah Victor Nnemeka

Amah Victor Nnemeka

IndividualLagos, Nigeria
Kim Maestro

Kim Maestro

Engineer at Trend


IndividualChengdu, China

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